• Technische Universität Darmstadt
• Computer Science Department (FB20)
• Embedded Systems & Applications Group (ESA)
• Hochschulstr. 10
• D-64289 Darmstadt


• Phone: +49 6151 / 16-22330
• E-Mail: lavan@esa.tu-darmstadt.de


• S2|02 Raum E121

Forschungsgebiete

• FPGA/GPU accelerators for sensor data processing

Lebenslauf

• 2015-2018

  Bachelor of Science in Computer Science, TU Darmstadt

• 2018-2021

  Master of Science in Autonomous Systems, TU Darmstadt

• April - October 2019

  Internship, European Space Agency ESOC

• since 2021

  Research Associate at the Embedded Systems and Applications Group (ESA)

Publications

1. Heinz, C., Kalkhof, T., Lavan, Y., and Koch, A. (2024). TaPaSCo-AIE: An Open-Source Framework for Streaming-based Heterogeneous Acceleration using AMD AI Engines. In 2024 IEEE International Parallel and Distributed Processing Symposium Workshops (IPDPSW). doi: 10.1109/IPDPSW63119.2024.00041
   Best Paper Award Preprint DOI
   Bibtex

   @inproceedings{heinz2024raw,
     author = {Heinz, Carsten and Kalkhof, Torben and Lavan, Yannick and Koch, Andreas},
     booktitle = {2024 IEEE International Parallel and Distributed Processing Symposium Workshops (IPDPSW)},
     title = {TaPaSCo-AIE: An Open-Source Framework for Streaming-based Heterogeneous Acceleration using AMD AI Engines},
     year = {2024},
     doi = {10.1109/IPDPSW63119.2024.00041}
   }
   

2. Strobl, J., Solis-Vasquez, L., Lavan, Y., and Koch, A. (2024). Graphtoy: Fast Software Simulation of Applications for AMD’s AI Engines. In Applied Reconfigurable Computing. Architectures, Tools, and Applications. Springer International Publishing. doi: 10.1007/978-3-031-55673-9_12
   Preprint DOI Slides
   Bibtex

   @inproceedings{strobl2024arc,
     author = {Strobl, Jonathan and Solis-Vasquez, Leonardo and Lavan, Yannick and Koch, Andreas},
     title = {Graphtoy: Fast Software Simulation of Applications for AMD’s AI Engines},
     booktitle = {Applied Reconfigurable Computing. Architectures, Tools, and Applications},
     year = {2024},
     publisher = {Springer International Publishing},
     doi = {10.1007/978-3-031-55673-9_12}
   }
   

3. Spang, C., Lavan, Y., Hartmann, M., Meisel, F., and Koch, A. (2022). DExIE - An IoT-Class Hardware Monitor for Real-Time Fine-Grained Control-Flow Integrity. In Journal of Signal Processing Systems (Vol. 94, pp. 739–752). doi: 10.1007/s11265-021-01732-5
   Preprint DOI URL
   Bibtex

   @inproceedings{spang2022jsps,
     author = {Spang, Christoph and Lavan, Yannick and Hartmann, Marco and Meisel, Florian and Koch, Andreas},
     title = {DExIE - An IoT-Class Hardware Monitor for Real-Time Fine-Grained Control-Flow Integrity},
     journal = {Journal of Signal Processing Systems},
     year = {2022},
     month = jul,
     day = {01},
     volume = {94},
     number = {7},
     pages = {739-752},
     issn = {1939-8115},
     doi = {10.1007/s11265-021-01732-5},
     url = {https://doi.org/10.1007/s11265-021-01732-5}
   }
   

4. Spang, C., Lavan, Y., Hartmann, M., Meisel, F., and Koch, A. (2021). DExIE - An IoT-Class Hardware Monitor for Real-Time Fine-Grained Control-Flow Integrity. In Workshop on Design and Architectures for Signal and Image Processing (14th Edition), DASIP ’21 (pp. 26–34). New York, NY, USA: Association for Computing Machinery. doi: 10.1145/3441110.3441146
   Best Paper Award Preprint DOI URL Slides
   Bibtex

   @inproceedings{spang2021dasip,
     author = {Spang, Christoph and Lavan, Yannick and Hartmann, Marco and Meisel, Florian and Koch, Andreas},
     title = {DExIE - An IoT-Class Hardware Monitor for Real-Time Fine-Grained Control-Flow Integrity},
     year = {2021},
     isbn = {9781450389013},
     publisher = {Association for Computing Machinery},
     address = {New York, NY, USA},
     url = {https://doi.org/10.1145/3441110.3441146},
     doi = {10.1145/3441110.3441146},
     booktitle = {Workshop on Design and Architectures for Signal and Image Processing (14th Edition)},
     pages = {26–34},
     numpages = {9},
     keywords = {Fine-Grained Control Flow Integrity, IoT, Real Time, RISC-V, Hardware Security, Low Overhead},
     location = {Budapest, Hungary},
     series = {DASIP '21}
   }
   

5. Heinz, C., Lavan, Y., Hofmann, J., and Koch, A. (2019). A Catalog and In-Hardware Evaluation of Open-Source Drop-In Compatible RISC-V Softcore Processors. In IEEE Proc. International Conference on ReConFigurable Computing and FPGAs (ReConFig). IEEE. doi: 10.1109/ReConFig48160.2019.8994796
   Preprint DOI
   Bibtex

   @inproceedings{heinz2019reconfig,
     title = {A Catalog and In-Hardware Evaluation of Open-Source Drop-In Compatible RISC-V Softcore Processors},
     author = {Heinz, Carsten and Lavan, Yannick and Hofmann, Jaco and Koch, Andreas},
     booktitle = {IEEE Proc. International Conference on ReConFigurable Computing and FPGAs (ReConFig)},
     year = {2019},
     organization = {IEEE},
     doi = {10.1109/ReConFig48160.2019.8994796}
   }